| 摘要 |
PURPOSE:To conduct the control of the bonding arm constituting a wire-bonder in high precision and to improve the wire-bonding for various semiconductor devices by a method wherein the base end of the bonding arm is divided into three branches, which are respectively provided with the driving voice coil, the position detecting differential transformer and the speed detecting voice coil. CONSTITUTION:A bonding tool 6 is attached to one end of a bonding arm 2 constituting a wire-bonder 1, a metal wire 7, which penetrates the bonding tool 6, is brought into contact to semiconductor elements 9 to be disposed on a bonding stage 8 and a prescribed bonding is executed. In this constitution, the other end of the arm 2 is divided into three branches 10a, 10b and 10c and is fixed on a head 3, and a driving voice coil type linear motor 11 consisting of a magnetic yoke 11a and a coil 11b, a position-detecting differential transformer 12 and a speed-detecting voice coil type linear motor 13 consisting of a magnetic yoke 13a and a coil 13b are respectively attached to the branch 10a, the branch 10b and the branch part 10c. The head 3 is displaced through a bearing 4 and a rotating shaft 5 in such a way and the tool 6 is shifted to the optimum position. |
