An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.
申请公布号
DE2834836(C2)
申请公布日期
1987.01.29
申请号
DE19782834836
申请日期
1978.08.09
申请人
UNIVERSAL INSTRUMENTS CORP., BINGHAMTON, N.Y., US
发明人
RAGARD, PHILLIP A., BINGHAMTON, N.Y., US;SNYDER, MICHAEL D., CHENANGO BRIDGE, N.Y., US;WHITING, ROY MARVIN, BINGHAMTON, N.Y., US
