ETCHING PLASTICS ENCAPSULATED ELECTRONIC PACKAGES

摘要

In order to remove a region of encapsulation from a plastics encapsulated electronic package 10 to expose a portion of the encapsulated component, the package is placed in etchant 11 e.g. fuming nitric acid or concentrated sulphuric acid, and then a sharply defined beam of laser radiation is directed on to the surface to produce localised boiling of the etchant and thus localised etching action.