发明名称 MARKING METHOD FOR RESIN-SEALED ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To improve a marking property and the identification after marking by coating, drying or curing a laser marking resin on the prescribed portion of a resin-sealed electronic component, and then laser-marking it. CONSTITUTION:After laser marking resin is coated, dried or cured on the prescribed portion of a resin-sealed electronic component, the portion is laser- marked. The resin of the component may use all synthetic resins such as sole or mixture, or modified resin of phenol resin, epoxy resin, unsaturated polyester resin, and the component may use electric parts such as capacitor, diode, transistor, filter, rectifier, resistor, coil, IC or all electronic parts. Thus, the marking property and the identification function after marking are improved to provide excellent marking method of the resin-sealed electronic component.</p>
申请公布号 JPS6220355(A) 申请公布日期 1987.01.28
申请号 JP19850159163 申请日期 1985.07.18
申请人 MATSUSHITA ELECTRIC WORKS LTD;MATSUSHITA ELECTRIC IND CO LTD 发明人 IMAZU TSUYOSHI;TAKAISHI TERUHISA;SUGIURA YASUO;NISHIDA KOJI
分类号 H01L23/00;H01L23/28;H01L23/544 主分类号 H01L23/00
代理机构 代理人
主权项
地址