| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition having a high curing rate with radiations and capable of providing a tough and flexible cured product having high heat resistance by including an oligomer having imide bonds, a polyalkylene polyether chain and (meth)acrylic groups as a constituent component. SOLUTION: This composition comprises an oligomer containing one or more imide bonds and the content of the imide groups is preferably the one based on 200-10,000 molecular weight. One or more polyalkylene polyether chains are contained in the oligomer. The number of carbon atoms in the alkylene is 2-6 and the number-average molecular weight is 300-20,000. The content of the polyalkylene polyether chain is 30-97 wt.%. The oligomer contains >=1, preferably 1-6 (meth)acrylic groups. The number-average molecular weight of the oligomer is preferably 500-21,000. The method for producing the oligomer is carried out by reacting a compound having 2 acid anhydride groups with a polyalkylene polyether having amino groups at both ends in the presence of acetic anhydride and then reacting the resultant product with an acrylate or a methacrylate having isocyanate group.
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