CIRCUIT BOARD FOR WIRE BONDING AND MOUNTING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board for wire bonding which enables high density wiring and high density mounting. SOLUTION: In this circuit board for wire bonding, an insulating layer 2 is formed at a semiconductor chip mounting position of a circuit board on which a semiconductor chip 12 is mounted. A wiring pattern 4a of the circuit board to be electrically connected with a bonding electrode 3 on the circuit board which is wire-bonded from the semiconductor chip 12 is formed to be drawn inside the semiconductor chip mounting position where the insulating layer 2 is formed on the board surface having the bonding electrode 3.