发明名称 Resin composition for sealing electronic parts, and hydration-resistant magnesia powder and process for preparation thereof.
摘要 <p>Disclosed is a resin composition for sealing electronic parts, which comprises a thermosetting resin and, incorporated therein, high-purity magnesium oxide. A hydration-resistant magnesia powder having the particle surfaces covered with a continuous and uniform coating of silica is advantageously used as the magnesium oxide. This hydration-resistant magnesia powder is prepared by introducing a heated vapor of an organic silicate compound into a reactor of a fluidized bed of magnesia powder heated at 100 to 600°C so that the concentration of the organic silicate compound is 1 to 20 mole%, and precipitating a coating of silica on the surfaces of magnesia particles by thermal decomposition and/or hydrolysis of the organic silicate compound on the surfaces of magnesia particles.</p>
申请公布号 EP0209847(A2) 申请公布日期 1987.01.28
申请号 EP19860109760 申请日期 1986.07.16
申请人 UBE INDUSTRIES, LTD. 发明人 HAMAMOTO, TOSHIKAZU;AOI, MOTOJIROU;YOSHIDA, KOZABURO;TODA, YASUHIKO
分类号 C01F5/02;C08K3/22;C08K9/02;C09C1/02;H01B3/10;H01B3/40;H01B7/282;H01B7/29 主分类号 C01F5/02
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