发明名称 |
Resin composition for sealing electronic parts, and hydration-resistant magnesia powder and process for preparation thereof. |
摘要 |
<p>Disclosed is a resin composition for sealing electronic parts, which comprises a thermosetting resin and, incorporated therein, high-purity magnesium oxide. A hydration-resistant magnesia powder having the particle surfaces covered with a continuous and uniform coating of silica is advantageously used as the magnesium oxide. This hydration-resistant magnesia powder is prepared by introducing a heated vapor of an organic silicate compound into a reactor of a fluidized bed of magnesia powder heated at 100 to 600°C so that the concentration of the organic silicate compound is 1 to 20 mole%, and precipitating a coating of silica on the surfaces of magnesia particles by thermal decomposition and/or hydrolysis of the organic silicate compound on the surfaces of magnesia particles.</p> |
申请公布号 |
EP0209847(A2) |
申请公布日期 |
1987.01.28 |
申请号 |
EP19860109760 |
申请日期 |
1986.07.16 |
申请人 |
UBE INDUSTRIES, LTD. |
发明人 |
HAMAMOTO, TOSHIKAZU;AOI, MOTOJIROU;YOSHIDA, KOZABURO;TODA, YASUHIKO |
分类号 |
C01F5/02;C08K3/22;C08K9/02;C09C1/02;H01B3/10;H01B3/40;H01B7/282;H01B7/29 |
主分类号 |
C01F5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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