| 摘要 |
PURPOSE: A wire bonding apparatus is provided to reduce a wire loop height by adopting a wedge-type bonding and further to overcome a limitation in a bonding direction. CONSTITUTION: The wire bonding apparatus includes a capillary, which can realize a wedge bonding regardless of a bonding direction. The capillary of a cylindrical shape has a hole(52a) through which a wire is passed. In particular, a tip(52b) of the capillary is formed of a cylindrical shape. An outer edge(52c) of the tip(52b) is rounded off, and further, an inner edge(52d) meeting the hole(52a) is rounded off. The rounded inner edge(52d) relieves stress applied to the wire in the hole(52a), preventing the wire from being cut, and allowing a free bonding in any direction. In addition, the tip(52b) may have a groove(52e) formed between the hole(52a) and the outer edge(52c) for more effective bonding. |
