| 摘要 |
PURPOSE:To improve the bonding workability by eliminating the uniform thickness of a welding ring. CONSTITUTION:A ceramic package for a semiconductor device can be readily positioned with a cap 3, a welding ring 1 having irregular thickness is provided, the allowable height 2 of the package for the device is increased, and a bonding can be performed with margin. In other words, the welding ring of ring shape having a sectional shape as shown is used, the cap 3 is coated and welded. Thus, a bonding can be facilitated. |
