| 摘要 |
PURPOSE:To avoid faulty operation caused by deformation of a metallic thin wire, with certain strength applied, by covering ridge lines of a semiconductor substrate with an insulating material. CONSTITUTION:A metallic thin wire 4, by which an electrode 2 on the surface of a semiconductor substrate 1 and a lead 3 in a container are connected, is shaped as shown in broken lines when it is usual. Assuming that the metallic thin wire is deformed, as shown in full lines, caused by vibration and shock during use in an integrated circuit and besides by an own-weight strain owing to its length, the metallic thin wire will remain electrically insulated, if ridge lines, comprising the upper and side surfaces of the semiconductor substrate, are covered with a non-electroconductive material 6. This treatment prevents faulty operation from occurring. |
