| 摘要 |
PURPOSE:To check the parasitic effect of a pellet, and to enable to perform stable bonding by a method wherein a bed under a plating layer is made to have a projecting type partially, and connection between the pellet and the plating layer according to a bonding wire is performed at the parts thereof. CONSTITUTION:A plating layer 12 consisting of Ag, for example, is formed on a bed 11 consisting of Cu, for example, and the circumferential part of the bed 11 and the part the plating layer 12 are formed in projecting types using a press, etc. Then a pellet 14 is mounted on the bed 11 interposing the plating layer 12 and a solder mounting layer (a bonding agent layer) 15 between them. Moreover the surface of the pallet 14, a lead frame 16 and the plating layer 12 of the projecting part 13 are connected electrically through bonding wires 17 consisting of gold, and the pellet 14, etc. are sealed with a resin layer 18 to form a semiconductor device.
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