| 摘要 |
An electronic device having a thick film interconnection substrate of a multilayer configuration having a major surface on which conductor patterns for mounting thereon IC chips or the like elements and wiring conductor patterns are formed. A noncrystallizing glass layer is deposited on the major surface with the chip mounting conductor patterns being exposed while the wiring conductor patterns are covered. A crystallizing glass layer is formed on the noncrystallizing glass layer. The IC chips or other elements as mounted are packaged in a hardening composition layer. A device exhibiting an improved moisture proofness and thus a high reliability is realized.
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