发明名称 GROUND CONNECTION APPARATUS OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To attain both a cost reduction and a certain ground connection by attaching low cost parts simply to a case. SOLUTION: A PC board 3 is mounted on a case 2 made of an aluminum die cast, and an earth contact of the printed circuit board and the case 2 are bonded with an earth wire 10. A ground of the case side is connected with a bolt 12 for ground connection to the case 2, and by giving nickel plating on a head upper surface 12a1 of the bolt, it is managed to a predetermined surface coarseness, and a wire bonding by ultrasonic crimping is carried out by making an upper surface of the bolt-head section into a putt surface.
申请公布号 JP2001313094(A) 申请公布日期 2001.11.09
申请号 JP20000130516 申请日期 2000.04.28
申请人 AISIN AW CO LTD 发明人 AOIKE KOJI;MURAKAMI NAOTAKA;NAGATA TOSHIO;SUZUKI KENJI
分类号 H01R4/62;H01L21/60;H01R4/02;H01R4/64 主分类号 H01R4/62
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