发明名称 MICROENCAPSULATED EPOXY ADHESIVE SYSTEM
摘要 <p>A microencapsulated epoxy adhesive system is disclosed comprising in admixture epoxy resin capsules and encapsulated "Ancamine TL"TM (Pacific Anchor Chemical Co.) as the curing agent. When applied, for example to a zinc plated bolt and the bolt is tightened, the capsules break and the resin cures and provides good breakaway torques. In a further embodiment of the invention, the epoxy adhesive system includes a filler.</p>
申请公布号 CA1217294(A) 申请公布日期 1987.01.27
申请号 CA19820400674 申请日期 1982.04.07
申请人 CAPSULATED SYSTEMS, INC. 发明人 HART, RONALD L.;WORK, DALE E.;DAVIS, COLIN E.
分类号 C09J7/02;C08J3/24;C09J163/00;F16B33/06;F16B39/22;(IPC1-7):C08L63/00;C09J3/16;F16B39/34 主分类号 C09J7/02
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