发明名称 SEALING MOLD APPARATUS
摘要 PURPOSE:To prevent the yield of thin burr, by forming at least two protruded parts in parallel, in an apparatus, in which the protruded parts are provided on the parting surface of a mold in parallel with the longitudinal direction of a tie bar part. CONSTITUTION:When the amount of plastic deformation of a lead frame h2 is small with respect to a protruded part 4a (preset value is h1), which is provided on the parting surface of a mold, thick burr 8 is yielded on the lead frame on the side of the mold inner than the protruded part 4a. The thick burr 8 is connected to a mold part 7. Therefore, the thick burr remains to the final process, and defects are caused in the products. In order to eliminate the thin burr, a protruded part 9 is further provided on the side of the mold inner than the protruded part 4. Thus, the thick burr 8 is cut from the mold part 7 and removed until the final process. The width of the protruded part 4 for removing the thin burr is made to be m1 (m1 is about 1/2 the width of a tie bar 3) with respect to a line l1 on the inner side of the tie bar 3 of the lead frame 1. The protruded part 9 for removing the thick burr 8 is provided on the side of the mold inner than the protruded part 4. The width of the protruded part 9 is made to be m1, too.
申请公布号 JPS6215827(A) 申请公布日期 1987.01.24
申请号 JP19850154575 申请日期 1985.07.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMURA KEIZO;OTSUKA SHIGERU;FUJIMOTO SUEKICHI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29K101/10;B29L31/34 主分类号 H01L21/56
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