| 摘要 |
PURPOSE:To provide an electrically conductive paste which has excellent resistance to hydrolysis and adhesion to a large IC chip and gives a semiconductor device having improved reliability on moisture resistance, consisting of a modified resin, a norbornene ring-contg. resin and an electrically conductive powder. CONSTITUTION:90-70wt% modified resin (A) obtd. by reacting a poly-p- hydroxystyrene of the formula with an epoxy resin having an MW of 500 or above and contg. an average of at least three epoxy groups per molecule in about an equivalent ratio, 10-30wt% norbornene ring-contg. resin (B) (e.g. petroleum resin), an electrically conductive powder (C) (e.g. Ag powder) and optionally, additives (D) such as anti-foaming agent, coupling agent, etc., are kneaded and the mixture is deaerated in a vacuum. |
