| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device having, proper soldering wettability, when the device is mounted, even if silicone adhesive is used as a heat resistant adhesive tape and the semiconductor device used therefor. SOLUTION: The method for mounting the semiconductor device comprises a step of soldering a circuit board using the device, in which a contaminant substance caused by the silicone adhesive is adhered to an outer pad and its adhering amount of the substance is 20 mg/m2 or less. |
