| 摘要 |
PURPOSE:To increase the reliability of the device by preventing a thermal destruction by shortening sharply the heating time of a soldering item by arrang ing the preheater to preheat the soldering item at the outer part and inner part of the inlet port of the vapor chamber forming a saturated vapor phase. CONSTITUTION:The temp. of a soldering item 31 is raised with the action of the radiation heat of the first preheaters 56, 57 when a soldering item 31 is transferred inside the external part hood 43 at the inlet port 41 of a vapor chamber 12 by a conveyor 51. The temp. of the soldering item 31 is rapidly raised then with the simultaneously action of the radiated heat from the second preheaters 61, 62 are evaporated latent heat of a vapor phase 71 on the soldering item 31 delivered inside the vapor chamber 12. And when the soldering item 31 is passed through the space between the preheaters 61, 62, the evaporated latent heat of the vapor phase 71 only is operated and the soldering item 31 is heated upto the paste solder melting temp. to solder the electronic component W of the above of the paste solder onto a base plate P. |
