| 摘要 |
This invention provides a technique capable of solving a problem of an ununiform plating on an annular edge portion of a surface to be plated of a wafer, which ununiform plating is usually caused due to an ununiform flow of a plating solution in a conventional cup-type plating apparatus, thereby ensuring a uniform plating treatment on an entire surface to be plated of a wafer. In detail, the present invention is directed to a cup-type plating apparatus comprising a wafer support section 2 provided along an upper opening of a plating tank 1, a plurality of solution-outlet passages 7 provided below the wafer support section 2 and extending from the inside of and to the outside of the plating tank 1, at least one solution-supply pipe 6 provided through the bottom of the plating tank 1. In use, a plating solution supplied through the at least one plating -solution-supply pipe 6 by virtue of an upward flow of the plating solution, is caused to form a plurality of outward flows passing through the plating-solution outlet passages 7 and thus reaching the outside of the plating tank 1, while at the same time the plating solution is caused to contact the surface 4 to be plated of a wafer 3 mounted on the wafer support section 2, to whereby carry out a plating treatment on the wafer 3. The apparatus of the invention is characterized by a stirring device 17, 18 for effecting a forced agitation of the plating solution supplied into the plating tank 1, provided below the surface 4 to be plated of the wafer 3 mounted on the wafer support section 2.
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