发明名称 |
HEAT RADIATING LAMINATED STRUCTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heat radiating laminated structure capable of being manufactured through drastically reduced manufacturing manhours. SOLUTION: The heat radiating laminated structure comprises a rigid heating panel 12, a rigid heat radiating panel 14 and a connecting means 16 for connecting the panels 14 and 16. A liquid adhesive obtained by adding a heat conductive filler to a reactive resin is applied in one line or a plurality of lines on one or both of opposing faces of the panels 12 and 14, and then the connecting means is formed by a connecting layer 16 by pressing and curing. The connecting layer 16 exhibits an initial tack strength (15 minutes after initiation of curing) of 0.01 Mp or higher and a thermal conductivity of 0.40 W/m.K.</p> |
申请公布号 |
JP2002277185(A) |
申请公布日期 |
2002.09.25 |
申请号 |
JP20010076490 |
申请日期 |
2001.03.16 |
申请人 |
KENSETSU RUBBER KK;CEMEDINE CO LTD |
发明人 |
KOBAYASHI SATORU;MIYAJIMA KAZUTO;AIZAWA YUKIHIKO;YAMAYA HIROSHI |
分类号 |
F28F3/00;B32B7/02;B32B7/14;C09J163/00;C09J175/04;C09J183/04;C09J201/00;G06F1/20;G09F9/00;H05K7/20;(IPC1-7):F28F3/00 |
主分类号 |
F28F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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