发明名称 COOLING LAYOUT FOR HEAT CONDUCTION OF ELECTRIC COMPONENT MEMBER
摘要 A protection against overheating not only of the heat transmitting component (2), but also of the components (3) surrounding said component is achieved. A latent heat store (1) is provided between the heat transmitting component (2) or a part thereof and a component (3) to be protected from overheating or a part thereof. The latent heat store (1) comprises a latent heat storing agent, whose melting-point T is between the operating temperature of the heat transmitting component (2) and the maximum permissible temperature of the component (3) to be protected. The quantity is proportioned so that the storage capacity of the latent heat store (1) is sufficient for the amount of heat maximally to be transmitted by the heat transmitting component (2). Between the heat transmitting component (2) and the latent heat source (1) and between the latent heat store (1) and the component (3) to be protected a thermal insulation (4,5) is provided. The melting-point T of the latent heat storing agent and the thicknesses d of the insulations (4,5) are proportioned so that the temperature gradient DELTA T/d from the heat transmitting component (2) which is at operating temperature to the latent heat store (1) is greater than the temperature gradient DELTA T/d from the latent heat store (1) to the component (3) to be protected.
申请公布号 JPS6213097(A) 申请公布日期 1987.01.21
申请号 JP19860155208 申请日期 1986.07.03
申请人 PHILIPS GLOEILAMPENFAB:NV 发明人 YOHAN SUKUREDAA;KURAUSU GAURON;REO BERUTORAMU;HIYUUGO SHIENMAN
分类号 F28D20/00;A45D20/12;C09K5/00;C09K5/06;C09K5/08;H05K7/20 主分类号 F28D20/00
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