发明名称 |
LEAD FORMAT FOR TAPE AUTOMATED BONDING |
摘要 |
A lead frame (20) for tape automated bonding includes individual leads (12) each having a stretch loop (40) to accommodate elongation of the loop as the lead is bonded to a substrate (28) after inner lead bonds have been formed to an integrated circuit (26). Such a lead frame allows temporary connection and testing of the circuit prior to final lead formation and packaging. |
申请公布号 |
EP0091376(B1) |
申请公布日期 |
1987.01.21 |
申请号 |
EP19830400687 |
申请日期 |
1983.04.01 |
申请人 |
FAIRCHILD CAMERA & INSTRUMENT CORPORATION |
发明人 |
PHY, WILLIAM S. |
分类号 |
H01L21/60;H01L23/495;H05K1/02;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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