TRANSMISSION CIRCUIT ELEMENT

摘要

PURPOSE:To miniaturize the constitution of a BPF of a transmission circuit element by laminating alternately a metallic thin film chip and an insulator thin film chip. CONSTITUTION:The metallic thin film chip 2 and the insulating thin film chip 3 forming the BPF are laminated alternately on a dielectric substrate 1 and the thin film chips 2 opposing to each other are shifted by the 1/2 operating wavelength. The occupied area is less than the case with the arrangement of the metallic thin film chips as a plane on the dielectric substrate through the lamination above and the constitution of the BPF of the transmission circuit element is miniaturized.