BONDING METHOD FOR WAFER AND MASK,申请号JP19850136828-传众专利搜索

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发明名称	BONDING METHOD FOR WAFER AND MASK
摘要
申请公布号	JPS6211231(A)	申请公布日期	1987.01.20
申请号	JP19850136828	申请日期	1985.06.25
申请人	HITACHI ELECTRONICS ENG CO LTD	发明人	AIKO KENJI;NAMIKI YOSHIJI
分类号	G03F7/20;H01L21/027;H01L21/30	主分类号	G03F7/20
代理机构		代理人
主权项
地址

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