Semiconductor component for row and column uses, has plastic housing including a wiring structure connected to flip chip contacts and uses two different metal alloys for conductors

摘要

A semiconductor part has a plastic housing (2), a wiring structure (3) with contact spots (5) in plastic (4) on a connection surface and connected to flip-chip contacts (8) of the chip. The back of the contact spots (11) has projecting external contacts (12) of the same alloy as flip-chip contact connections (7) but differ from the contact spots alloy. Independent claims are also included for the following: (a) a carrier for the above;and (b) a production process for the above.