发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE:The titled composition which can cure into a flexible film within a short time by irradiation with light, heating or the like, comprising a PVA resin of a block character above a specified value, a polymerizable vinyl compound and a polymerization initiator. CONSTITUTION:A curable resin composition containing a PVA resin (A) of a block character [eta] >=0.55 (preferably, one having a block character >=0.60, a degree of saponification of 30-95mol%, and a degree of polymerization of 200-2,000), a polymerizable vinyl compound (B) [e.g., hydroxyalkyl (meth) acrylate] and a polymerization initiator (C) (e.g., a benzoin compound). By using resin A having a block character >=0.55, this composition can cure into a film rich in flexibility within a short time by irradiation with light or heating. This composition is useful for paints, adhesives, molding materials and printing board materials.
申请公布号 JPS6210103(A) 申请公布日期 1987.01.19
申请号 JP19850148981 申请日期 1985.07.05
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 MARUHASHI KIICHI;OISHI TSUKASA
分类号 C08F261/00;C08F2/44;C08F261/04;G03F7/004;G03F7/032;G03F7/033;G03F7/038 主分类号 C08F261/00
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