发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a short-circuit and so forth from generating in the leads by a method wherein grooves are respectively provided in each lead by performing a press working on the inner lead part. CONSTITUTION:Groove parts 4 are provided on leads 2'. This manufacture is, for instance, a method of providing the grooves 4 by performing a press working on the metallic plate which is used as the material before the leads 2', an island 1 and so forth are punched. By pressing the grooves 4, the material, metallic plate, is work-hardened and the second moment of area of each lead 2' is augmented. As a result, the leads 2' respectively enhance the resistance thereof to the forces in the left and right directions and the upper and lower directions as well and the bending thereof is lessened, thereby enabling to prevent a short-circuit and a wire-open from generating in the leads 2'.
申请公布号 JPS629655(A) 申请公布日期 1987.01.17
申请号 JP19850148866 申请日期 1985.07.05
申请人 NEC KYUSHU LTD 发明人 KAWAHARA YOSHITOKU
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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