| 摘要 |
PURPOSE:To restrain the mounting density from dropping in an IC device by a method wherein the island region is separated into plural lead frames and at least a part of the lead frames is used as a lead frame for either the power potential or earth potential or the other signal conductor. CONSTITUTION:An island region 1 is connected its one side to the substrate of the IC through a lead frame 3a and a contact hole 9 and is connected its other side to the substrate through a lead frame 3b and a contact hole 11. Accordingly, as the power potential or earth potential can be fed through the lead frame on one side, the lead frame on the other side does not need the external lead pins. The contact hole for electrically connecting the island region with the lead frame and the region for connecting the bonding wire with the pad have only to exist in the lead frame on the other side. |
