| 摘要 |
PURPOSE:To completely prevent plated metal films from being peeled off and to improve the soldering properties, by plating nickel to provide a prime coating layer for a plated gold layer and plating ruthenium on the plated nickel film so as to form thin film. CONSTITUTION:A plated gold layer 8 is provided on the surface of a metal so that an electronic component package is formed. Before providing the plated gold layer 8, nickel is plated as a prime coating layer for the plated fold layer 8 and then ruthenium is plated on the plated nickel film 6 to form a thin film 7. During the heating of the package, the ruthenium serves as an effective barrier for preventing silicon contained in the pellet 9 from being diffused into the plated nickel film 6 and preventing nickel from being diffused into the plated gold layer 8. Accordingly, the plated metal films are completely prevented from being peeled off and the soldering properties can be improved. |
