| 摘要 |
PURPOSE:To improve the terminal density of inner lead wires, by using laminated materials for a lead frame, and forming the tip connecting part of each laminated material so that the thickness becomes thin step by step. CONSTITUTION:The thickness of a tip part of each laminating material 1, which constitutes a lead frame, i.e., an inner lead 1A, is made thin step by step. Therefore, a pitch P2 of the inner lead 1A becomes one half a pitch P1 of a conventional lead frame. Thus the density of terminals can be enhanced twice. Since the distance between the electrode of a semiconductor element and the inner lead 1A can be made short, the lead frame is advantageous in molding and for various conditions. |
