发明名称 |
Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor |
摘要 |
A method is provided for fabricating a double-sided wiring board for mounting an electronic component thereon having metal wiring patterns formed both on upper and lower sides of an electrically-insulating board. The metal wiring patterns are electrically connected each other through a through-hole and/or a blind via-hole. The method has the steps of: laminating a metal layer with a support substrate on at least one side of the electrically-insulating board; removing the support substrate from the metal layer so that the metal layer is left on the electrically-insulating board; and forming the through-hole and/or the blind via-hole in the electrically-insulating board.
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申请公布号 |
US2006219428(A1) |
申请公布日期 |
2006.10.05 |
申请号 |
US20050255025 |
申请日期 |
2005.10.21 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
CHINDA AKIRA;MIYAMOTO NOBUAKI |
分类号 |
H05K1/09;H05K1/11;H05K3/10 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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