Device for wave soldering with a nozzle having openings, which density changes in the feeding direction of the workpieces

摘要

The printed circuit boards (4) are guided on a slightly inclined conveying line (3) along a soldering wave (2) created by a nozzle (1) positioned below. The soldering tin (7) is moved from the inner space (9) at the nozzle (1) through openings (8) integrated in the upper surface. The distance between the openings (8) decreases form the higher area (6) to the lower area (5) in order to compensate the difference in speed created by the material (7) guided along an inclined surface.