| 摘要 |
PURPOSE:To completely prevent a plated a metal film from being peeled off and to improve the soldering properties, by providing a plated nickel film as a prime coat of the plated gold layer and providing a plated platinum film on the plated nickel film. CONSTITUTION:A plated fold layer 8 is provided on the surface of a metal so that an electronic component package is formed. Before providing the plated gold layer 8, nickel is plated to form a plated nickel film 6 as a prime coat and then platinum is plated on the nickel film to form a a film 7. According to this construction, the platinum serves as an effective barrier, during the heating of the package, for preventing the silicon contained in a pellet 9 from being diffused into the plated nickel film 6 and preventing the nickel from being diffused into the plated gold layer 8. Consequently, the plated metal film are prevented from being peeled off and the soldering properties can be improved. |
