| 摘要 |
<p>A method of assembling a surface-mounted component (5) onto a substrate, comprising applying a deposit of solder cream to the substrate, preheating to boil off volatile material from the solder cream, and securing the component (5) by adhesive to the substrate prior to a reflow stage to solder the component (5) to the substrate, wherein the component (5) is supplied as part of a stream of such components by a carrying medium (2, 10), in which the adhesive is applied to the component (5) through cut-outs (7) immediately prior to its location on the substrate. The application of the adhesive to the component, rather than to the board, cuts out a step in the proCessing of the substrate. The carrying medium may be a composite paper tape consisting of three layers (1,2,3), a flexible multiple blister pack consisting of two layers (1, 10), each of which has multiple cut-outs (7), or a magazine having a single cut-out. When the components (5) are placed on the printed circuit board in their assigned position the adhesive achieves a secure mechanical bond between the board and the components thus preventing the components from moving, lifting or being blown off during the course of the reflow operation when components are fused by molten solder to the printed circuit board.</p> |
