发明名称 THERMAL HEAD
摘要 PURPOSE:To reduce the number of terminals led out to the exterior of a sub strate, by a construction wherein a conductor disposed in proximity to a driving IC is divided into a plurality of conductors, and one of them is used as a lead terminal for a new image signal supplying conductor. CONSTITUTION:ICs 1-5 are to be mounted on a thermal head substrate. Electrodes of a head-driving IC, e.g., V, I, G, CL, an image signal input electrode Pi, an image signal output electrode Po and a recording current ground electrode PG are connected respectively to corresponding conductors (v), (i), cl, pi or po, pg or the like on the substrate. The ground conductor pg is divided into two pieces, one of which is made to function as an original recording current ground conductor pg', while the other p1' is connected to a conductor po' and further to the image signal input electrode on the IC4. The other end of the conductor p1' is connected to a conductor c1' disposed adjacent thereto. Namely, the conductor c1' functions as an external lead terminal for a new image signal supplying conductor.
申请公布号 JPS627568(A) 申请公布日期 1987.01.14
申请号 JP19850147243 申请日期 1985.07.03
申请人 NEC CORP 发明人 SATO YOSHIHIKO
分类号 B41J2/345;H01L49/00;H04N1/032 主分类号 B41J2/345
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