| 摘要 |
<p>PURPOSE:To prevent a rejected part due to defective bonding force by a method wherein the printed-circuit portions of a planar printed-circuit board, onto which a plurality of printed-circuits are neatly arranged, are pressurized more positively than other portions so as to suppress bubbles generating in an adhesive layer. CONSTITUTION:Firstly, a pair of planar printed-circuit boards, onto which printed-circuit patterns 4 are formed, are prepared, coated with adhesive 5 and pasted together with each other. Secondly, the resultant pasted board assembly is placed on the jig planes 1 of a hot press in the state that spacers 2 are located so as to completely cover the respective printed-circuits 4 individually in order to contact-bond the assembly under heat. The thickness of the spacer 2 is preferably 5mum or more so as to develop enough pressure difference between the printed-circuit portion and the remaining portion such as the portion between the printed-circuit portions and the like. A matter, which is easily shaped into a flat surface body with uniform thickness and at the same time stands against pressure and heat, such as Teflon, silicone rubber, copper or the like is employed as the material for the spacer.</p> |
