METHOD FOR MANUFACTURING OF MULTI-LAYER PCB USING INK JET PRINTING TYPE

摘要

A method for manufacturing a multi-layer PCB(Printed Circuit Board) using an inkjet printing type is provided to enhance productivity and reduce cost by simplifying a manufacturing process of the multi-layer PCB. A method for manufacturing a multi-layer PCB(Printed Circuit Board) using an inkjet printing type includes the steps of: applying an adhesive insulator on a substrate(S10); completing a coverlay formed as one body with the substrate by applying the adhesive insulator on a bottom part of the substrate(S20); inkjet-patterning by the inkjet printing type to form circuit patterns after completing the coverlay(S30); heat-treating to evaporate a solvent of injected ink after inkjet-patterning(S40); completing a singular substrate by forming the circuit patterns on the coverlay of the substrate after heat-treating(S50); stacking the plurality of singular substrates according to the number of required layers after completing the singular substrate(S60); hardening by pressing and heating after stacking(S70); and completing the multi-layer PCB(S80).