| 摘要 |
PURPOSE:To dispose semiconductor pellets separated when a sheet is elongated at the prescribed places by forming the roughness of the back surface of a semiconductor wafer to the specific value or lower, setting the thickness of the wafer to a special range or lower, thereby eliminating the shortcircuit of wirings with the edge of the pellet or the deformation of the wirings. CONSTITUTION:After the surface of a semiconductor wafer 4 is processed as prescribed, it is so ground that the roughness of the back surface of the wafer 4 becomes 0.3mum or less and the thickness becomes 300-500mum. Then, after the wafer 4 is placed on a sheet 1, it is diced at 3, the sheet 1 is extended to separate the wafer 4, thereby obtaining pellets 9. Then, the pellets 9 and the leads 5 are connected by wirings 6 therebetween, and the leads 5, the wirings 6 and the pellet 9 are contained in a package 10. Thus, since the back surface of the wafer 4 becomes flat rough surface of 0.3mum or less, the bondability with the sheet is improved, when the sheet 1 is extended, the pellets 9 are aligned regularly to improve the efficiency of automatically absorbing work. Since the pellet 9 has a thickness of 500mum or less, the wirings 6 are not shortcircuited with the end of the pellet 9.
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