| 摘要 |
PURPOSE:To reduce an electrostatic capacitance between an electrode pad for bonding and a substrate by a method wherein the electrode is composed of the extension parts of internal patterns and bonding reinforcing parts composed of an assembly of independently separated small patterns. CONSTITUTION:An electrode pad 2 is composed of the extension parts 3 of internal patterns and bonding reinforcing parts 4 formed around the extension parts 3. The reinforcing parts 4 are separated from the extension parts 3 and each part 4 is composed of an assembly of independently separated small patterns. When a bonding wire 1 is connected to the pad 2, the bonding is so performed as to bring the wire 1 into contact with at least one point on the extention parts 3. |
