| 摘要 |
PURPOSE:To form a plated film causing no swelling by using an electroless copper plating soln. consisting of copper ions, a copper ion complexing agent, a reducing agent, a pH adjusting agent, water, monoethanolamine and polyethylene glycol. CONSTITUTION:This electroless copper plating soln. for forming a plated film on a ceramic substrate is an aqueous soln. contg. copper ions from copper sulfate or the like at about 0.004-0.2mol/l concn., a copper ion complexing agent such as EDTA at about 0.004-1mol/l concn., a reducing agent such as formaldehyde at about 0.01-0.25mol/l concn., a pH adjusting agent such as NaOH enough to adjust the soln. to about 11.0-13.5pH, monoethanolamine added by about 0.01-50g/l and polyethylene glycol having about 200 - several million mol.wt. added by about 0.01-30g/l. The swelling of a plated film formed on a ceramic substrate is prevented by using the electroless copper plating soln. |
