| 摘要 |
PURPOSE:To prevent generation of common impedance between the frame terminal and each of the circuits, by installing an exclusive pad for each of the circuits on the IC chip, and connecting it with the bonding wire to the frame terminal which is commonly used by a plurality of circuits. CONSTITUTION:The circuit 1 and the circuit 2 have the exclusive power source pads 241 and 242 and the exclusive grounding pads 243 and 244, respectively. Each of the power source pads 241 and 242 and the power source terminal 22 are interconnected with each of the bonding wires 251 and 252, respectively. In the same way, each of the grounding pads 243 and 244 and the grounding frame terminal 23 are interconnected with each of the bonding wires 253 and 254, respectively. In this case, the common impedance does not exist between the circuit 1 and the circuit 2, so that the signal interference does not occur between the circuit 1 and the circuit 2. |
