| 发明名称 |
VERFAHREN ZUR METALLISIERUNG VON KERAMIK |
| 摘要 |
<p>The present invention relates to a process for wet metal-plating of ceramic substrates. More particularly this invention relates to the wet chemical copper plating of Al2O3 ceramics. It is essentially composed of a combined chemical pretreatment of the ceramic surface for chemical metallization without external electric current in such a manner that within only a single pretreatment step the substrate surface is chemically activated and is simultaneously covered with an adhesion promoter, and/or a sensitizer and/or an activator (catalyst).</p> |
| 申请公布号 |
DE3523957(A1) |
申请公布日期 |
1987.01.08 |
| 申请号 |
DE19853523957 |
申请日期 |
1985.07.04 |
| 申请人 |
LICENTIA PATENT-VERWALTUNGS-GMBH |
发明人 |
BOGENSCHUETZ,AUGUST-FRIEDRICH,PROF.DR.RER.NAT.;OSWALD,ROBERT,DR.-ING.;L.,DR.RER.NAT. JOSTAN,JOSEF |
| 分类号 |
C04B41/88;C23C18/18;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):C23C18/18;H01L21/88;H01L49/02;H01G13/00 |
主分类号 |
C04B41/88 |
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