| 摘要 |
<p>A reflow treatment unit and a reflow treatment method are provided to detect easily an end point of a reflow process by monitoring a state of the reflow process. A reflow treatment unit performs a reflow process for floating and modifying a resist layer by applying a solvent to the resist layer having a pattern formed on a surface of a substrate. The reflow treatment unit includes a process chamber(41) for receiving the substrate. The reflow treatment unit further includes a holding plate(43) for holding the substrate in the process chamber. A solvent supply part is formed to introduce the gas including the solvent into the process chamber. A measurement part is formed to detect modification degree of the resist layer.</p> |
