| 摘要 |
A repairing apparatus of a BGA package is provided to perform easily a bad BGA package removal process by using a balance weight. A repairing apparatus of a BGA package separates a printed circuit board(100) and a BGA package(200) mounted on the printed circuit board from each other. A heating unit applies hot wind to the printed circuit board and the bad BGA package. A separation unit(300) is positioned under the bad BGA package to separate the bad BGA package and the printed circuit board from each other. The separation unit includes a bracket(310) fixed to the outside of the bad package and a balance weight(320) positioned at a lower center surface of the bracket. |
