Sealing semiconductor casings

摘要

Disposed is a semiconductor apparatus having an outer case 10 mounted on a heat radiating plate 1 on which an electrically insulating plate 2 to carry a semiconductor chip 4 with external terminal electrodes 3 electrically connected with the chip is placed. The outer case is provided with an opening 10a on a sidewall thereof and the semiconductor chip together with the external terminal electrodes is sealed within the outer case by gelled resin 8 and a rigid resinous member 9 through which outer end portions of the external electrodes are led out.