| 摘要 |
<p>PURPOSE:To prevent the damage of the surface of a semiconductor wafer by pushing an adhesive tape, etc. against the semiconductor wafer by slight force, preparatorily bonding the adhesive tape, etc. with the back of the wafer, increasing air pressure in a vacuum chamber and completely bonding the adhesive tape, etc. with the back of the wafer by the change of air pressure. CONSTITUTION:The inside of a chamber 3 is decompressed by a vacuum pump 7. When a cam member 29a or 29b is separated from a guide roll 30a or 30b, a roller 23 is rolled on the back of a wafer 13, an adhesive tape, etc. 17 are pushed against the wafer 13 by slight pushing force approximately the same as its own weight of the roller 23, and the adhesive sheet, etc. 17 are bonded preparatorily with the peripheral region of the back of the wafer 13. The roller 23 is lifted, an air valve 10 is opened, atmospheric air is introduced into the chamber 3, and pressure in the chamber 3 is brought to atmospheric pressure or pressure close to it. The thin adhesive tape, etc. 17 are sucked to the back of the wafer 13 by the rise of pressure in the chamber 3 and bonded completely extending over the whole surface. Uniform and stable bondings are ensured among the adhesive tape, etc. 17 and the wafer 13, thus resulting in no enfolding of bubbles, etc.</p> |
