| 摘要 |
<p>PURPOSE:To enable to disperse a stress to generate at the package parts which come in contact with the upper end edges on the periphery of the main surface of a pellet and to prevent a crack and so forth from generating by a method wherein the upper end edges of the pellet, which is mounted on a resin-sealed semiconductor device, are cut off and the corner parts thereof are eliminated. CONSTITUTION:The corner parts of the upper end edges on the periphery of the main surface of a pellet 3, that is, the surface, where elements such as a transistor and so forth and wirings have been formed, are cut off and curved surfaces 6 are formed. Namely, the contact parts of the upper end edges of the pellet 3, which come in contact to the package parts whereon a stress due to the thermal cycle and so forth of this resin-sealed semiconductor device concentrates, are respectively formed in such a way that the cross-sectional configurations thereof are respectively a configuration that each corner part of the pellet 3 has been cut off by forming a curved surface 6 on each upper end edge of the pellet 3, for the purpose of attaining a relaxation of the stress to generate at the package parts, which come in contact with the upper end edges of the pellet 3, by making the stress disperse. The curved surfaces 6 are provided smoothly and continuously over both of the main surface and side surfaces of the pellet 3. The curved surfaces 6 may be formed in such a way as to have a constant curvature or may be formed in such a way that the curvatures thereof are changed. The curved surfaces 6 formed on the four sides of the pellet 3 are also provided in such a way as to generate no corner part.</p> |
