| 摘要 |
PURPOSE:To prevent the connection of a bonding wire by setting the size of a space between a bonding pad, to which the bonding wire is connected on the basis of an angle formed with a chip side of the bonding wire, and a bonding pad adjacent to the bonding pad so as to be proportional to the inverse number of the sine of the angle. CONSTITUTION:The size of spaces among a plurality of bonding pads disposed on a chip is set so as to be proportional to the inverse number of the sine of angles shaped with a chip side of a bonding section for an external lead and bonding wires connected among the bonding pads on the basis of said angles so that the bonding wires are not brought into contact mutually even at either position of the bonding pads. Spaces among bonding wires 15a-15e severally connecting the bonding pads 12a-12e and bonding sections 14a-14e are equalized even at either position, and are not reduced at the corner sections of the chip. Accordingly, contacts in all the bonding wires can be prevented effectively. |
