| 摘要 |
<p>PURPOSE:To prevent corrosion in a bonding lead by forming constitution in which needle traces are not shaped to a bonding pad not connected to an external lead. CONSTITUTION:A plurality of bonding pads 2a-2e are disposed onto the upper surface of a semiconductor chip 1, and the bonding pads 2a, 2c, 2e among them are connected to external leads 4a, 4c, 4e formed to a case 3 through metallic small-gage wires 5. When the bonding pads 2a, 2c, 2e and the external leads 4a, 4c, 4e are connected by the metallic small-gage wires 5, the needle traces of probe needles 11 generated in these bonding pads 2a, 2c, 2e are covered by connecting the metallic small-gage wires 5, and no needle trace is generated in the bonding pads 2b, 2d, thus exposing no needle trace to the surface. Accordingly, corrosion from the needle traces of a bonding pad 2 can be prevented, thus improving the reliability of a semiconductor integrated circuit.</p> |
