Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card.

摘要

1. A method of mounting an integrated circuit (12) on a support (11), consisting in piercing holes (16) into the support ; in closing the holes by a metallic layer (15) applied on one face (11a) of the support and ; in welding the connecting elements (14, 25) of the integrated circuit (12) opposite the holes to metallic layer (15), characterised in that, prior to the welding operation, it consists in deforming the metallic layer towards the interior of each of the holes to form projections (17) therein.